Newsroom Archives - 2024
Welcome to Indium Corporation's newsroom archives. Here you will find Indium Corporation's global communications activities, as well as our media interviews.
Indium Corporation Experts to Present at SMTA International
October 18, 2024
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout SMTA International (SMTAI), October 21-24, in Rosemont, Illinois.
Indium Corporation to Showcase Solder Products, New Flux-Cored Wire Formula at SMTA International
October 17, 2024
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its innovative products and technical presentations at SMTA International (SMTAI), from October 21-24, in Rosemont, Illinois.
Indium Corporation Experts to Present at International Electronics Manufacturing Technology Conference
October 14, 2024
Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.
Indium Corporation to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
October 2, 2024
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 8-10, in Detroit, Michigan
Indium Corporation to Showcase Innovative Electronics Assembly Products at International Symposium on Microelectronics
September 27, 2024
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
Indium Corporation Experts to Present Advanced Research at International Symposium on Microelectronics
September 20, 2024
Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
Indium Corporation Earns Mexico Technology Award for High-Reliability Alloy for Solder Paste
September 13, 2024
Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse® HR. The award was presented during an awards ceremony on September 11 at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico.
Indium Corporation Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
September 6, 2024
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
Indium Corporation Engineer to Showcase High-Reliability Alloy Innovation at Delsys Tech Day
September 4, 2024
Indium Corporation Junior Application Engineer Siegfried Lorenz will present as part of Delsys Tech Day on Wednesday, September 11, in Lucerne, Switzerland.
Indium Corporation to Showcase Durafuse® Solder Technology at Productronica India
August 30, 2024
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara
August 28, 2024
Indium Corporation® will feature a range of industry-leading, high-reliability solder products at the Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico, September 11-12.
Indium Corporation to Showcase Innovative Materials Powering AI Technology at SEMICON, Taiwan
August 27, 2024
As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.
Indium Corporation Technical Manager to Present on Solder Solutions for Cutting-Edge Solutions for AI and Automotive at SEMICON
August 26, 2024
Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.
Indium Corporation Awards Silver QuillHonor to Authors of Cutting-Edge Technical Content
August 8, 2024
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award.
Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
July 17, 2024
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market
June 26, 2024
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.
Indium Corporation Expert to Present at High-Temperature Electronics Network Conference
June 18, 2024
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
June 14, 2024
Indium Corporation® is proud to introduce Durafuse® HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse® mixed-alloy technology.
Indium Corporation Welcomes 13 New Interns Into Award-Winning Program
June 12, 2024
Indium Corporation is pleased to welcome 13 new interns into its award-winning summer internship program. Indium Corporation’s internship program is a launch pad for talented college students
Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH
June 11, 2024
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager. With a career spanning over three decades in business management and sales leadership, Wagner brings not just a wealth of experience, but also a proven track record of transformative leadership that is set to drive positive change at Indium Corporation Advanced Materials GmbH.
Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
June 4, 2024
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
Indium Corporation Expert to Present at MiNaPAD 2024
May 27, 2024
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at the 11th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD) Forum, taking place June 19-20 in Grenoble, France.
Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect
May 21, 2024
Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging Production Line exhibition at SMTconnect, June 11-13, in Nuremberg, Germany.
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
May 17, 2024
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Indium Corporation Experts to Present on High-Temp, Lead-Free Solder Paste & High Reliability Liquid Metal Alloys Poster at ECTC
May 16, 2024
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
Indium Corporation Expert to Present on Alternative Solder Alloys to Solve Emerging Challenges at SMTA Rocky Mountain Expo
May 14, 2024
Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on May 16 in Aurora, Colorado. The presentation, Exploring Alternative Solder Alloys and Their Beneficial Attributes, will examine alternative alloys with enhanced reliability performance.
Indium Corporation Experts to Present at Electronics in Harsh Environments SMTA Conference
May 13, 2024
Indium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Indium Corporation Experts to Present on Power Electronics at PCIM Europe
May 13, 2024
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.
Indium Corporation to Showcase HIA Materials at ECTC
May 7, 2024
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
April 30, 2024
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Indium Corporation Earns New Product Introduction Award for Low-Voiding, Pb-Free Solder Paste
April 11, 2024
Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in Anaheim, California, on April 10.
Indium Corporation to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications
April 9, 2024
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part of Indium Corporation’s free InSIDER Series, will be hosted on LinkedIn Live on April 17 at 11 a.m. EST.
Indium Corporation’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan
April 2, 2024
Indium Corporation's Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024). The presentation will take place on April 18 in Toyama, Japan, as part of the iNEMI session. During the presentation, Lim will discuss the results of a technical paper titled Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging. The full conference is being held April 17-20.
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
March 28, 2024
Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe's premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
March 26, 2024
Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
Indium Corporation Technical Expert to Present at Critical Materials Council Conference
March 21, 2024
Indium Corporation's Principal Engineer – Advanced Materials Andy C. Mackie, Ph.D., MSc, is scheduled to present on day one of the 2024 Critical Materials Council (CMC) Conference taking place April 10-11 in Chandler, AZ, U.S. The two-day event provides actionable information, on materials and supply-chains, for current and future semiconductor manufacturing.
Indium Corporation’s Rick Short to Retire After 40 Years of Service
March 20, 2024
Indium Corporation Corporate Associate Vice President Rick Short is retiring, concluding a distinguished career of 40 years with the global electronics materials manufacturer based in Central New York.
Indium Corporation to Feature Innovative Solutions from Portfolio of Thermal Management Products at SEMI-THERM
March 19, 2024
Indium Corporation® will feature an array of its innovative thermal management solutions at SEMI-THERM, March 25‒28, in San Jose, CA.
Indium Corporation Experts to Present Throughout IPC APEX Expo
March 14, 2024
Indium Corporation's leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.
Indium Corporation Celebrates 90 Years of Materials Science Innovation
March 13, 2024
Indium Corporation, a global leader in materials science and electronics assembly solutions, will commemorate its 90thanniversary on March 13. Indium Corporation's innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.
Indium Corporation Technical Manager to Present at SMTA Taiwan Tech Forum
March 12, 2024
Indium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou's presentation will highlight the growing demand for high reliability and low-temperature solder solutions brought on by the rapidly developing electric vehicle (EV) and artificial intelligence (AI) industries.
Indium Corporation Experts to Present at SEMI THERM
March 6, 2024
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.
Indium Corporation to Feature Durafuse® Solder Technology, EV Products at APEX 2024
March 4, 2024
With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, California, U.S.
Indium Corporation to Feature New Semiconductor Products for HIA and SiP at IMAPS Device Packaging Conference
February 29, 2024
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation®will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 18‒21, in Fountain Hills, AZ.
Indium Corporation Showcases Metal Thermal Interface Materials for Burn-In and Test at TestConX
February 28, 2024
Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
February 28, 2024
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation®is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.
Indium Corporation Earns Supplier Award from Jabil
February 26, 2024
Indium Corporation has earned the prestigious Supplier Award in China from Jabil Wuxi, a trusted partner for the world's top brands, offering comprehensive engineering, manufacturing, and supply chain solutions. The award was presented as part of Jabil Wuxi's 20th anniversary celebration on January 26.
Indium Corporation to Kick Off Season Three of EV InSIDER Live Webcast Series with Charging Session
February 8, 2024
Indium Corporation's EV InSIDER Live webcast series is set to launch its third season on February 22 with a live LinkedIn session titled Fixing America's Broken Fast Chargers, featuring special guest Kameale Terry. Terry is co-founder and CEO of ChargerHelp!, a company that enables on-demand repair of EV charging stations.
Indium Corporation Prepared to Deliver Three Presentations at APEC 2024
February 6, 2024
As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.
Indium Corporation to Showcase High-Reliability Materials for Power Electronics at APEC
January 31, 2024
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.
Indium Corporation Expert to Present Technical Paper at IMAPS France
January 29, 2024
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical paper on January 31 at IMAPS France – 17th European Advanced Technology Workshop on Micropackaging and Thermal Management in La Rochelle, France.
Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Europe
January 24, 2024
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.
Indium Corporation Announces Updates to China Leadership Team
January 18, 2024
Indium Corporation is pleased to announce the promotions of Taylor Wang and Walter Wang, key members of its China-based leadership team. Taylor Wang has assumed the role of Associate Director, China Sales, while Walter Wang has taken on the position of Associate Director, Operations.
Indium Corporation Technical Expert to Present at India Electronics Week
January 17, 2024
Indium Corporation's Principal Engineer – Advanced Materials, Andy C. Mackie, Ph.D., MSc, is scheduled to deliver an insightful presentation on advanced packaging and heterogeneous integration as part of India Electronics Week. As part of one of the largest conferences on electronics in Asia, the presentation is scheduled for 12:00 p.m. local time on February 2 at KTPO Whitefield in Bengaluru, India.
Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan
January 16, 2024
Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
January 11, 2024
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Indium Corporation Experts to Present at SMTA Pan Pac
January 9, 2024
Two Indium Corporation experts are set to deliver technical presentations on low-temperature soldering at the upcoming Pan Pacific Strategic Electronics Symposium (Pan Pac), hosted by SMTA, January 29–February 1 in Hawaii.
Indium Corporation Expert to Present at Power Device & Module Expo at NEPCON Japan
January 4, 2024
Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24 in Tokyo. The presentation will explore trends in EV power electronics and the interconnect materials that enable them.