Chris Bastecki of Indium Corporation at SMTAi 2019
Chris Bastecki of Indium Corporation join SCOOP's Philip Stoten to discuss their latest low temperature solution and how Indium solves problems engineer-to-engineer with their customers.
Newsroom
Welcome to Indium Corporation's newsroom. Here you will find Indium Corporation's global communications activities, as well as our recent media interviews.
Media Interview Archive
SCOOP Apex 2019
Successful partnerships are all about mutual value for both partners and the customer, and the ‘Voiding Clinic’ run by Indium and KIC at APEX 2019 is no exception.
Chris Bastecki, Director of Sales and Global PCBA Marketing: discusses with EMS Now Indium Corporation’s emerging solutions that address customer challenges, especially in high-reliability and low-temperature applications.
Dr. Richard McDonough, Global Application Engineer/Semiconductor Product Specialist discusses Indium Corporation’s new silver sintering paste product offering with Global SMT & Packaging News. QuickSinter® delivers consistent, high-speed sintering on a variety of surfaces and die metallizations and works well in both high- and low-temperature pressureless applications.
Chris Nash, Product Manager, PCBA Assembly Solder Paste speaks with RealTime with IPC APEX regarding the company’s high-reliability solder products for 5G electrical reliability and ICT performance. Nash also reviewed Indium Corporation’s presence in other markets, including the automotive industry.
Chris Nash, Product Manager, PCBA Assembly Solder Paste discusses the company’s 85-year history with EDACafé. He also talked about Indium Corporation’s new low-temperature alloy, Durafuse™ LT, as well as its new PicoShot™, and QuickSinter® products.
Chris Nash, Product Manager, PCBA Assembly Solder Paste participated in What’s New in Electronics’ 5G technologies roundtable. He provided insight on what 5G will mean for the industry, including the increasing needs of automotive electronics and Indium Corporation’s approach to materials solutions for 5G.
Chris Nash, Product Manager, PCBA Assembly Solder Paste debated the challenges, applications, and trade-offs of low-temperature solders during a Global SMT & Packaging moderated panel. Nash discussed how Indium Corporation’s new high-reliability low-temperature alloy technology Durafuse™ LT offers improved drop shock performance compared to other brittle low-temperature alloys, among other benefits.
Kay Parker, Technical Support Engineer met with RealTime with IPC APEX to discuss her career as a young professional, including how she used her internship with Indium Corporation as a way to further her education, gain clarity through real-world experience, and ultimately, get a job with the company.
Tim Twining, Vice President of Marketing provided Indium Corporation’s outlook on industry trends and developments with What’s New in Electronics TV.
Media Contacts:
Jingya Huang
Marketing Communications Assistant Manager