Thermal Management
Indium Corporation is the leader in metal thermal interface materials (TIMs).
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Read MoreWhat Makes a Good Thermal Interface Material?
There are many considerations that can figure into your thermal interface material selection.
Read MoreAll of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials.
Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. It's ductility and thermal conductivity make it ideal as a compressible thermal interface material. For the thermal K values of other thermally conductive materials, check out our thermal K list.
Metal TIMs can be divided into two categories:
- Solder TIMs that reflow and melt to form a mechanical bond
- Compressible TIMs that serve as gap fillers and do not need heat to form a bond
Compressible (or non-reflow) TIMs include:
Solder interconnects can also act as a thermal interface.
Indium Corporation makes over 200 different alloys for solder preforms. These alloys can be pure indium, indium alloys, Pb-free, or Pb-contained. Please consult one of our technical support engineers to identify the best metal TIM for your application.
Solder TIMs include:
Burn-In & Test
Metal burn-in materials have several advantages:
- High thermal conductivity
- Easy handling and cleaning
- No pump out or bake out
- Ability to handle multiple insertions
- Available in standard or custom configurations
Power Semiconductor
Indium Corporation manufactures die-attach solder paste for vacuum soldering. Indium Corporation's IGBT die-attach solder paste can be screen printed or stencil printed and is easy to clean.
Indium Corporation also provides solder ribbon and solder preforms for die-attach applications. Tape & reel packaging allows preforms to be advanced and placed with speed and accuracy. Semiconductor-grade ribbon and preforms come in ultra-pure alloys and adaptable packaging, such as tape & reel, custom spools, and cartridge packs, to increase productivity, performance, and efficiencies.
All material is recyclable and reclaimable.
TIM1, TIM1.5, TIM2
Indium Corporation continues to lead the way in developing cutting-edge thermal interface materials (TIMs) and processes, including applications for TIM1, TIM1.5, and TIM2.
- TIM1: Solder preforms are used as a solder thermal interface material between a processor die and a heat-spreader at the TIM1 level.
- TIM1.5: In mobile applications or bare die applications, such as laptops or video graphics boards, there is no heat-spreader. Instead, the die is in direct contact with the cooling solution. That is why we call this thermal interface level TIM1.5. Here we recommend our compressible thermal materials, such as Heat-Springs® or liquid metal
- TIM2: In the TIM2 level between the heat-spreader and the heat-sink we also recommend our compressible interface material - Heat-Springs® or liquid metal
Thermal K Values List
Denotes Materials that Indium Corporation can provide
| Indalloy® Number | Material | Thermal Conductivity W/(m - K) | Remarks |
|---|---|---|---|
| Diamond | 1300-2400 | ||
| Pure Silver | 429 | ||
| 200 | 100Au | 318 | |
| Pure Aluminium | 240 | ||
| 4 | Pure Indium | 86 | |
| 290 | 97In3Ag | 73 | |
| 128 | 100Sn | 73 | |
| 3 | 90In10Ag | 67 | |
| 201 | 91Sn9Zn | 61 | |
| 182 | 80Au20Sn | 57 | |
| 227 | 77.2Sn20In2.8Ag | 54 | |
| 106 | 63SnPb37 | 50 | |
| 9 | 70Sn18Pb12In | 45 | |
| 2 | 80In15Pb5Ag | 43 | |
| 204 | 70In30Pb | 41 | |
| 1E | 52In48Sn | 34 | |
| 1 | 50In50Sn | 34 | |
| 121 | 96.5Sn3.5Ag | 33 | |
| 205 | 60In40Pb | 29 | |
| 205 | 60In40Pb | 29 | |
| 133 | 95Sn5Sb | 27 | |
| 281 | 58Bi42Sn | 19 | |
| 19 | 51In32.5Bi16.5Sn | |
|
| 51 | 62.5Ga21.5In16Sn | 40 | |
| Phase Change Materials | 3 - 8 | ||
| Thermal Grease | .75 - 6 | ||
| Ag - Filled Die Attach | 1.3 - 5 | ||
| Molding Compounds | 0.6 - 0.7 | ||
| BT Epoxy | 0.19 | ||
| FR - 4 | 0.11 |