Bump Fusion

Bump Fusion

Indium Corporation’s wafer bumping (bump fusion) fluxes are low-viscosity fluxes spun onto solder-bumped and copper-pillar/solder-capped wafers. They are designed to remove oxides and other contamination during the reflow and cleaning steps. These fluxes are halogen-free and can be applied via dispense or spin coating.
Bump Fusion
Flux Name Description Cleaning Method
SC-5R For use with high-Pb, SnPb eutectic, and SnAg solder bumps Solvent or aqueous-based chemistry
WS-3401 20-65 micron pitch copper pillars with SnAg or Sn100 microbumps Warm DI water
WS-3543 20-65 micron pitch copper pillars with SnAg or Sn100 microbumps Warm DI water
Bump Fusion
For more information about Indium Corporation’s bump fusion fluxes, please contact: