Flux-Free, Virtually Zero Residue, Material

This advanced material is specifically designed for use with formic acid reflow equipment to create solder joints. It is non-reactive and leaves virtually no residue after reflow, ensuring a true no-clean process without the need for typical flux residue cleaning. This near-zero residue also avoids any compatibility issues with subsequent assembly steps, such as underfilling or molding.

Two people in cleanroom suits examine a silicon wafer, ensuring fluxless soldering processes are optimized inside the high-tech manufacturing facility.

Innovative Material for Critical Applications

Virtually Zero Residue

After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.

No Cleaning Necessary

Reduced chemical costs and fewer process steps help contribute to sustainability goals.

Enhanced Compatibility

No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.

Eliminate Electrochemical Migration

Only benign chemicals that fully evaporate are used, eliminating the risk of ECM.

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