Applications
Flux-Free, Virtually Zero Residue, Material
This advanced material is specifically designed for use with formic acid reflow equipment to create solder joints. It is non-reactive and leaves virtually no residue after reflow, ensuring a true no-clean process without the need for typical flux residue cleaning. This near-zero residue also avoids any compatibility issues with subsequent assembly steps, such as underfilling or molding.

Overview
Revolutionize with Flux-free Materials for Formic Acid Reflow
Formic acid reflow process is a cutting-edge technology to achieve reliable solder joints without using traditional flux. This allows for creating clean solder joints that minimize the risk of electro-chemical migration, especially for high power/voltage and sensitive assembly. It also eliminates the typical flux residue cleaning step, thus reducing cleaning solution and electricity consumption. Indium Corporation is at the forefront of developing flux-free materials, including flux-free solder pastes for this technology.
Benefits
Innovative Material for Critical Applications
Virtually Zero Residue
After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.
No Cleaning Necessary
Reduced chemical costs and fewer process steps help contribute to sustainability goals.
Enhanced Compatibility
No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.
Eliminate Electrochemical Migration
Only benign chemicals that fully evaporate are used, eliminating the risk of ECM.
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