Applications
Immersion Cooling
A new era for data centers is here—driven by enhanced energy efficiency and sustainability through immersion cooling. Material compatibility with immersion fluids is critical in both single- and two-phase systems. Indium Corporation’s Heat-Spring® solutions deliver reliable thermal interface material for top performance in both immersion fluid types.
Overview
Heat-Spring® preforms are proven TIMs compatible with all immersion fluids
Dielectric fluid can dissolve organic compounds in TIMs over time, leading to contamination of the fluid and filter. Thermal grease and other polymer-based TIMs eventually degrade and are not recommended. Instead, opt for metal-based TIMs, which are proven to offer superior thermal performance and longevity.
Benefits
High Thermal Conductivity
With indium Heat-Spring®, thermal conductivity can reach up to 86W/mK.
Application Expertise
With over 90 years of experience in indium application and manufacturing, we are a proven leader in the industry.
Non-dissolvable
Heat-Spring® will not dissolve in either single-phase or two-phase immersion cooling liquid.
Compressible
The special pattern is designed to reduce contact resistance.
Immersion Cooling Products
Immersion cooling is an advanced thermal management technique where components are submerged in a thermally conductive, dielectric liquid. Heat is efficiently dissipated as the coolant circulates. For this innovative application, Indium Corporation’s trusted products are the preferred choice.
Heat-Spring®
A renowned soft metal alloy thermal interface
Phase Change Metal TIMs
Discover the advantages of PCMA TIMs over liquid
Liquid Metal and Liquid Metal Paste
Liquid metals that are RoHS-compliant and
Solder TIMs
Solder TIM solutions offer superior reliability and thermal
Related Applications
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
TIM1, TIM1.5, TIM2
Metal-based TIMs deliver high thermal performance and
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