前段时间，我们公司的技术研发副总裁，行业的技术领头羊—-李宁成博士接受了《新电子工艺》杂志的采访。
李博士在采访中，介绍了我们Indium公司的概况，我们业界领先的无铅焊接材料，这些锡膏的突出特性，公司一系列的焊料产品，以及我们公司的焊料在SMT方面的发展策略等！
"The article is regarding interviewing Dr. Ning-Cheng Lee on the topic of "The leader of lead-free solder materials – Indium Corporation".
1. Please introduce history of Indium Corp.
2. What make Indium the far ahead leader in lead-free solder materials?
3. Besides LF materials, does indium have other products?
4. What is the strategic goals in the near future?
5. What are the traits of Indium LF solder materials making them so competitive?
6. Indium must have a unique management system to make it so superior. Please describe this system." (quoted from Dr. Lee)
谢谢李博士的详细分享交流，谢谢《新电子工艺》杂志的独特报道！
View Dr. Ning-Cheng Lee's Interview
Cheers!
Pic: Indium intranet & 《新电子工艺》