Off to the 2008 IWLPC

I’m packing my bags and getting ready to fly to California again.  Depending on connectivity, I look forward to blogging from San Jose.  A small crew from Indium will be attending the International Wafer Level Packaging Conference this week.  If you are going to be in the area and would like to meet up with us, simply send me an e-mail and I’ll try to arrange a meeting.