The NanoBond® Process

To successfully use NanoFoil^®, you do not need to fully understand what it is or how it is made, although that does help.

It also makes for a very interesting story…

What is actually critical for you to use NanoFoil^® is to fully understand the NanoBond^® Process. This process consists of:

1. Design Considerations

• Choosing the Best Metallization
• Adding Solder to a NanoBond^® Assembly
• Flat Bonding Surfaces

2. Setup

• Surface Preparation
• NanoFoil^® Thickness
• NanoFoil^® X and Y Dimensions
• Aligning the Assembly
• Pressure During the NanoBond^® Process

3. Activation

• Laser Activation
• Electric Activation
• Thermal Activation

4. Reaction

• Wave Propagation
• Heat Penetration
• Heat Dissipation

5. Testing

• Ultrasonic Testing
• Cross Sectioning
• Shear Testing

This is a new process for most people, but not for our worldwide Technical Support team. Our engineers are experienced with this technology, and can help you set up the NanoBond^® Process. If you need help, or would like to learn more, support is only a click away.

We also offer NanoFoil^® research kits, so you can try this out for yourself.

Authored by previous Indium Application Manager Jim Hisert