Bismuth Wire

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Plugging and abandonment (P&A) is a part of the decommissioning process for wells in the oil and gas industry. Once the wells are no longer used for production or deemed uneconomical, the

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

Join us as we’re introducing our latest series, “Celebrating Women in

Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary cause of tin whiskers, minimizing these stresses will

Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary cause of tin whiskers, minimizing these stresses will

An alloy is a metal which is comprised of two or more metals. These metals are stable and have some level of solubility together; otherwise, they would not form an alloy and would exist as a

Solubility is the ability of one substance to dissolve into another substance. There are two ways to think of solder alloy solubility: one is when the alloy is created, and the other is when you are

You may not know that you are step soldering already, but you probably are! Step soldering is a process in which different melting point solders are applied from highest melting point to lowest