Mobile
Mobile devices are facing greater demands than ever—better cameras, sharper displays, and longer battery life—all packed into even smaller, more compact designs.


Overview
Finer Features, Bigger Challenges
As mobile devices continue to shrink, new challenges such as artificial intelligence, 5G integration, and sustainability add complexity for manufacturers. Indium Corporation offers advanced electronics packaging and assembly materials, including fine powders for precise printing or jetting, and innovative products for system-in-packaging assembly, helping you meet the demands of miniaturization.
Products for Mobile Devices Assembly


Display and Touch Sensor

Camera Module

Materials for Chargers

Main Logic Board (MLB)

Low-Temperature Shield and Interposer Attach

GaAs RF Chips

Flexible Printed Circuit (FPC)

System-in-Package (SiP)

Connector

MEMS Microphone
Benefits
Revolutionizing Mobile Manufacturing
with Innovative Soldering Solutions
Cutting-Edge Technology
Our patented Durafuse® LT is the only solution that seamlessly merges low-temperature properties with high reliability for mobile devices.
Expert Curation
With decades of experience, our team handpicks the best materials to ensure reliable final products and high yield.
Enhanced Reliability
From reducing HIP defects to ensuring low-voiding and excellent electrical reliability, our materials are engineered for unmatched consistency and performance.
Versatile Applications
Our extensive range of solder pastes, fluxes, and alloys is customized to address a variety of needs in mobile device manufacturing, including PCBA and SIP applications, as well as semiconductor packaging for sensors.
Related Applications
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.