Markets Mobile

Mobile

Person with mobile device

A detailed close-up view of mobile phone internal components, showcasing intricate circuit designs and technology, perfect for illustrating modern electronics and innovation.

Finer Features, Bigger Challenges

As mobile devices continue to shrink, new challenges such as artificial intelligence, 5G integration, and sustainability add complexity for manufacturers. Indium Corporation offers advanced electronics packaging and assembly materials, including fine powders for precise printing or jetting, and innovative products for system-in-packaging assembly, helping you meet the demands of miniaturization.

Revolutionizing Mobile Manufacturing
with Innovative Soldering Solutions

Cutting-Edge Technology

Our patented Durafuse® LT is the only solution that seamlessly merges low-temperature properties with high reliability for mobile devices.

Expert Curation

With decades of experience, our team handpicks the best materials to ensure reliable final products and high yield.

Enhanced Reliability

From reducing HIP defects to ensuring low-voiding and excellent electrical reliability, our materials are engineered for unmatched consistency and performance.

Versatile Applications

Our extensive range of solder pastes, fluxes, and alloys is customized to address a variety of needs in mobile device manufacturing, including PCBA and SIP applications, as well as semiconductor packaging for sensors.

Related Applications

Microchips on a printed circuit board

PCB Assembly

Proven and cutting-edge materials for PCB assembly

SiP & Heterogeneous Integration Assembly (HIA)

SiP & Heterogeneous Integration Assembly (HIA)

System-in-package (SiP) and heterogeneous integration solutions

Low-Temperature Soldering

Low-Temperature Soldering

Transform your operations with our low-temp soldering