Indium Corporation Features RMA-155 Pb-Free Solder Paste at SMTAi
August 28, 2014
Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier, even for long and hot profiles. It is halogen-free, resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes (QFNs).
RMA-155 conforms to the RMA classification for QQ-S-571F and offers proven performance similar to the well-received Pb-free Series solder pastes. Indium Corporation's full suite of compatible RMA materials include TACFlux® RMA-155, WF-2212 Wave Flux, FP-2212 Flux Pens, and CW807 Series Flux-Cored Wire.
Indium Corporation will be exhibiting at booth 430. For more information about RMA-155, visit www.indium.com/solder-paste-and-powders/.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.