Solder Fortification Preforms Revisited
Using Solder Fortification preforms to fix starvation voids caused by plated vias in the ground pad design....
Using Solder Fortification preforms to fix starvation voids caused by plated vias in the ground pad design....
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
This is the fourth in a series of posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Today's focus is v...
This is the third in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Quantifiable bondl...
This is the second in a series of blog posts discussing reinforced solder preforms for high–reliability and low voiding....
InFORMS® can help you reduce voiding, improve reliability, and enhance solder performance in high-power applications....
Indium Corporation is presenting 3 papers at the SMTA PanPac in February. Learn more....
The Soldering Station series is a continuation of a larger series entitled Wave Soldering (A Segmented Synopsis). Most recently we finished the Prehea...
With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of pre...
As discussed previously, the temperature of the preheater has little comparison with the actual temperature of the PCB. By implementing a dual p...
As I mentioned in my previous post the goal of preheating, regardless of method used, is to increase the metallic structure of the joint to a specifie...
SMTA International 2015 is just around the corner. If you want to see what our engineers will be presenting at the show check out this blog; there is ...