Why is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that i...
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
Find out why they are the best braze choice for your hermetic sealing application....
80Au20Sn solder preforms transfer heat from the active layer in laser diodes, creating a strong bond for long-term reliability. ...
80Au20Sn solder paste and preforms both have particular attributes that make them ideal for certain bonding applications. We take a look at how your p...
Gold-based solder alloys have superior strength and conductivity; perfect for applications requiring a high temperature, reliable bond that can hold u...
Creating an airtight or hermetic seal is a critical-- and an especially challenging-- requirement for high-reliability packages. The 72Ag28Cu profile ...
72Ag28Cu, pure Ag, and OFHC Cu brazes are user friendly and provide excellent finished goods reliability. ...
Summary: Gold solder alloys are valuable due to their unique range of reflow temperatures and their resistance to corrosion, making them ideal for hig...