Automotive: Solder Paste Particle Size Effect on Voiding in Bottom-Terminated Components
The results were very interesting as the ROL0 (halide-free) paste performed better than the ROL1 (halide-containing) solder paste. Generally, halides ...
Ed Briggs's Blog
Printing Differences Between No-Clean and Water-Soluble Solder Pastes
The printing differences between no-clean and water-soluble solder paste. Keywords: Phil Zarrow, Ed Briggs, ebriggs@indium.com, printing, water-solubl...
Electronics Assembly: An Introduction to Particle Size and Printing Smaller Area Ratios
This video is for anyone interested in the role of solder paste particle size with regard to reflow and printing. Keywords: Phil Zarrow, Ed Briggs, eb...
Growing Interest in Bi-Containing Solder Alloys: Bismuth Rocks!
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders...
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...
SMT Optimization For Success - Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...
Optimization for Success: Solder Mask Defined vs. Copper Defined Non-Solder Mask Defined) Pads
Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure 1. In the last discussion we statistically evaluated an...
Square with Radius Corners vs. Circular Apertures: SMT Optimization for Success Part 4:
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standar...
SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
Stencil Printing for SMT Assembly Success Part 2: Print Metrics
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
Stencil Printing for Success: Solder Paste Handling and Storage
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate
Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing a...