Lead-Free (Pb-Free)

No-Clean Lead-Free (Pb-Free) Solder Paste

Indium Corporation is proud to be your premier supplier of Pb-free solder paste.

Lead-Free Solder Paste Features & Benefits

As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
Preferred Products
Product Name Value Proposition
Indium8.9HF Best All-Around Halogen-free Paste
Indium8.9HFRV High TCT performance, low voiding, No-Clean paste
Indium8.9HF1 Enables In-Circuit Probe Testing
Indium10.8HF Addresses Non-Wet Opens (NWOs)
Indium10.1 Best All-Around Halogen-Containing Solder Paste
Product Name Value Proposition
Indium10.1HF Ultra-low voiding in air reflow
Indium8.9HFA Superior printing for miniaturization
Indium8.9 Eliminates head-in-pillow (HiP)
Indium12.8HF Specifically for fine-feature printing
Indium8.9E Excellent print transfer efficiency for the broadest range of processes
Indium8.9HFC Specially formulated to accommodate higher processing temperatures
Indium10.2HFA Unprecedented stencil print transfer efficiency
NC-SMQ230 A SAC solder paste with consistent repeatable printing performance combined with long stencil and tack times
Indium10.2HF A halogen-free SAC solder paste with excellent resistance to head-in-pillow (HIP) and non-wet opens (NWO) and unprecedented stencil print transfer efficiency
Indium5.8LS A halogen-free SAC solder paste designed for maximum print transfer efficiency and elimination of flux spattering

As a leader in soldering technology, Indium Corporation has a variety of tried and true solder pastes for Pb-free circuit board assembly. Here are some additional solder pastes designed to help you with many of your soldering challenges.

Low-Temperature Products
Product Name Value Proposition SDS
Indium5.7LT-1 A low-temperature, Pb-free solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. PDF
NC-SMQ80 An InSn solder paste specially designed for low temperature applications that need high mechanical reliability PDF

Key Features:

  • Low bottom termination component (BTC) voiding
  • Enhanced post reflow flux residue electrical reliability
  • Strong oxidation barrier promotes complete coalescence and HIP resistanceStrong oxidation barrier promotes complete coalescence
  • Resists flux spread to prevent surfaces from oxidizing

Indium8.9HF

Looking for an SMT Solder Paste that has Superior Printing and Voiding Performance?

  • Want enhanced electrical reliability to ensure your product life reliability?
  • Need it to be stable for room temperature storage and have a long stencil life?
We have your solution!

Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:

Indium8.9HF

Features:

  • Halogen-free, Pb-free, no-clean
  • High transfer efficiency with low variability
  • Unique resilient oxidation barrier technology
    • Eliminates Head-in-Pillow (HiP) defects
    • Eliminates graping defects and promotes complete coalescence
  • Robust reflow capability
    • Low-voiding with a vast array of thermal profiles and component styles
    • Wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects
  • Excellent pin-in-paste printability, solderability, and hole fill
  • Clear, restricted, encapsulating flux reside with enhanced electrical reliability (SIR/ECM)
  • Consistent lot-to-lot performance after storage and throughout the assembly process
  • Backwards compatible with Sn/Pb alloys

Key Features:

  • Excellent Void Reduction
  • iRobust Thermal Reliability
  • Superior Printability
  • No-Clean Convenience
  • Superior Wetting Performance

Indium8.9HFRV

High TCT Performance, Low-Voiding, No-Clean Paste

Indium8.9HFRV is a revolutionary, no-clean solder paste designed with a wide process window with exceptional reliability. It delivers low-voiding performance for high-reliability applications without the need for vacuum reflow setup. In addition, Indium8.9HFRV provides excellent stencil print transfer efficiency and response-to-pause performance. The paste is engineered to withstand the rigors of thermal cycling and boasts outstanding reliability under high-stress conditions.

Features:

  • Excellent Void Reduction: Without the need for vacuum reflow, its enhanced voiding performance leads to improved joint reliability, ensuring long-lasting connections even under demanding conditions.
  • Robust Thermal Reliability: Indium8.9HFRV provides excellent thermal cycling performance to withstand the harsh environment.
  • Superior Printability: The fine powder options allows for high printing resolution, resulting in consistent paste deposits and minimized bridging.
  • No-Clean Convenience: The residue left after reflow is benign, allowing for a streamlined post-soldering process without the need for additional cleaning steps.
  • Superior Wetting Performance: Formulated to work seamlessly with various surface finishes, Indium8.9HFRV wets to fresh and aged surfaces.

Applications:

Indium8.9HFRV is suited for a wide range of electronics assembly applications, particularly those involving high-reliability segments such as automotive electronics, industrial controls, and telecommunications. Its adaptability makes it the choice for manufacturers prioritizing quality, performance, and process efficiency.

For more information about Indium8.9HFRV and to explore how it can elevate your soldering processes, please contact our team.

Key Features:

  • Superior probe-testability
  • Outstanding BTC voiding minimization performance
  • Excellent print transfer efficiency and response-to-pause performance

Indium8.9HF1

8.9HF1 Solder Paste Enables In-circuit Probe Testing

Avoid the Void® Plus Exceptional In-Circuit Testing Performance with Indium8.9HF1

Indium8.9HF1 is specifically formulated to deliver outstanding voiding performance for bottom-terminated components (BTC) - plus a soft pliable flux residue post reflow, provides unprecedented in-circuit testing (ICT) and flying-probe testing first pass yields.

Enhanced ICT Performance:

Indium8.9HF1 is a Pb-free, no-clean solder paste intended for both air and nitrogen reflow that produces:

  • Fewer false testing failures which equates to faster cycle times and less rework
  • Highest first-pass yields in ICT
  • Soft post-reflow flux residue
Other Features:
  • Halogen-free per EN14582 test method
  • Outstanding BTC voiding minimization performance
  • High oxidation barrier eliminates graping and HiP defects
  • Provides a molten solder oxidation barrier that prevents further oxidation during reflow and Improves coalescence of small deposits
  • Excellent print transfer efficiency

Key Features:

  • Best-in-class high speed printing
  • Optimal print performance for the smallest components and apertures
  • Halogen-free and Pb-free

Indium8.9HFA

Indium8.9HFA Solder Paste Delivers Superior Printing for Miniaturization

Leading Print Performance on Miniaturized Components

Indium8.9HFA is a versatile, halogen-free, Pb-free solder paste with leading print performance on miniaturized components.

Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices, especially as they struggle with <8mil challenges associated with continuing miniaturization in the electronics assembly industry.

Indium8.9HFA Solder Paste provides:
  • Low Cost of Ownership & High Print Yields
    • Unsurpassed transfer efficiency for consistent, full volume print deposits (8 mil), results in reduced frequency of insufficients and high first-pass print yields
    • Low print pressure and excellent response-to-pause saves time and money on stencils and line changes
    • Solvent-free dry-wiping reduces costs
  • Increased throughput
    • Higher print speed and reduced wipe frequency enables short cycle time, high up-time, and high throughput printing
Indium8.9HFA works best in applications that require:
  • Fine feature printing that present challenges for yields (area ratios <0.66); this includes most personal electronics applications
  • High speed printing applications (>100mm/second or >4 inches/second)

Key Features:

  • Lowest levels of voiding for QFNs, BGAs, and CSPs
  • Oxidation inhibition promotes complete coalescence after long reflow profiles
  • Excellent HIP and graping performance

Indium10.1

Indium10.1 Solder Paste Best All-around Halogen-containing Paste

Leading Print Performance on Miniaturized Components

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 solder paste makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.

Indium10.1 solder paste enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 solder paste provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.

Indium10.1 works best in applications that require:

  • Wetting performance on difficult to solder or oxidized metallizations
  • Low BTC voiding
  • Outstanding HIP performance

Key Features:

  • Excellent non-wet open and HIP resistance
  • Low voiding on BGA/CSP/QFN
  • Outstanding print transfer and response-to-pause performance
  • Good all-around balanced performance

Indium10.8HF

Indium10.8HF Pb-Free Solder Paste Addresses Non-Wet Opens (NWOs)

Indium10.8HF solder paste enables low cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.

Indium10.8HF is versatile, with a balanced set of properties:
  • Meets leading OEM standards for
    non-wet open resistance
  • Oxidation barrier technology delivers strong resistance to:
    • Head-in-pillow defects
    • Graping (non-coalescence of powder particles)
  • Strong surface oxide cleaning and pad wetting during reflow ramp
  • Low voiding on BGSs, CSPs, and QFNs
  • Outstanding printing performance with high transfer efficiency and low variability
  • Excellent response-to-pause
Indium10.8HF works best in applications that require:
  • Warpage induced defect elimination; such as non-wet open and HIP. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.