Does Anyone Underfill Package-on-Package Components?
Some people do underfill PoP components with capillary underfill. This is done in one application step, there is no distinction between underfil...
Indium Corporation
博弈中的纳什平衡 Nash Equilibria in Game Theory
John Forbes Nash Game Theory img src="http://www.indium.com/_images/0509/price_1.jpg" alt="Pricing......
Ultra Low Res Flip Chip Flux
This is just an ultra low resolution picture of flip chip attachment flux, however ultra low residue flip chip attachment flux is clearly a great solu...
A Liquid Metals Handling Update
Have you seen the statement on Indium’s product data sheet for liquid metals that says: “Care should be taken in reheating the alloy in th...
Flat Sectioning
First flat section (just below the solder, looking up through the copper traces) img src="http://www.indium.com/_images/0507/chip_a...
Fine Feature Assembly Issues vis a vis Lead-Free
Folks, We are all aware that the miniaturization of electronics continues unabated. As consumers we benefit from this phenomenon, as electronic assemb...
Why Color A Flux?
Some flux height sensing equipment for flux reservoirs require a dye to be added in order to discern the level of a given flux pool. Colored flux can....
Clad Thermal Interface Materials
Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multipl...
Flashback - Contamination
I think the most useful thing I learned from chemistry in college was cleanliness. The first day of chem. lab we were asked to fill our beakers with.....
Thermal Conductivity of a Metal Alloy, Scientifically Determined
Bob Jarrett gave an excellent explanation of the thermal conductivity of metal alloys and their relationship with electrical conductivity. It is as fo...