I Make House Calls
If you need me to troubleshoot your ball attach process, PoP process, flip-chip assembly process, or die-attach process, I’d be happy to come an...
If you need me to troubleshoot your ball attach process, PoP process, flip-chip assembly process, or die-attach process, I’d be happy to come an...
Just in case you haven’t heard of epoxy flux yet, let me fill you in. Epoxy flux is what I call a “super no-clean” flux. A no-c...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
For the second half of Solder Paste Transfer Efficiency, I would like to talk about tolerances and the Rule of 10% Standard Deviation (σ). From ...
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
Stencil printing flux is easy if you know what to expect before attempting it. It is easier than stencil printing solder paste in most common apertur...
Folks, The team at Circuitnet has performed a poll on lead-free line usage. They asked the question: As we enter 2008, what percentage of your product...
Apart from independence from silicon, thin-film solar cells have several advantages. On perfect day and perfect conditions crystalline silicon solar c...