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- 2.5D and 3D packages
- Ball-attach
- Die-attach
- Flip-chip
- SiP and heterogenous integration
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Click here to download a larger version.
2.5D and 3D Packaging
Indium Corporation is a world leader in the design, formulation, manufacture and supply of semiconductor-grade fluxes and associated materials, enabling 2.5 and 3D assembly processes, as well as more standard flip-chip assembly.
We continue to work with leading customers and equipment partners to develop and optimize materials and associated assembly processes in this rapidly expanding area of technology.
Our offerings include:
- Bump fusion (wafer) fluxes for copper pillar / microbump formation
- 2.5D/3D fluxes for thermocompression bonding (TCB) assembly:
- Memory-stacking (memory cube)
- Memory on logic (3D)
- Logic and memory on interposer (2.5D)
- Standard flip-chip fluxes
Ball-Attach
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
Our Applications
WS-446HF
A no-intentionally-added halogen-free water washable ball-attach flux with an activator system powerful enough to promote wetting on the most demanding substrate metallizations
WS-575-C-RT
A halogen-compliant, room temperature stable, one-step flux that eliminates the need for pre-fluxing
WS-3600
A robust, halogen-containing flux that works well under challenging conditions
NC-585
Designed for PGA applications; eliminates issues caused by cleaning while still ensuring good solderability
Bump Fusion
Indium Corporation’s wafer bumping (bump fusion) fluxes are low-viscosity fluxes spun onto solder-bumped and copper-pillar/solder-capped wafers. They are designed to remove oxides and other contamination during the reflow and cleaning steps. These fluxes are halogen-free and can be applied via dispense or spin coating.
Die-Attach
The term die-attach is reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Flip-Chip
The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
Copper pillar/solder microbumps are emerging as a standard flip-chip solder bump replacement in many parts of the semiconductor assembly industry, from standard chip-attach to power devices using flip-chip on leadframe as assembly technologies. For logic and similar devices, substrate metallization (landing pad) technology has also shifted from solder-on-pad (SoP), manufactured from printed and reflowed and cleaned solder paste, to individual solder balls. The technology is now moving to simple organic solderability protectant (OSP) on copper.
SiP & Heterogeneous Integration & Assembly (HIA)
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA and SiP applications.
Indium Corporation’s soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications have a PROVEN track record with more than 2 billion SiP front-end module (FEM) SiP devices manufactured in the last 3 years using Indium Corporation materials.
MEMS Assembly
- Dispense consistently
- Reduce blow holes and solder creep
- Suitable for all high-melting alloys (220-255ºC)
- No-intentionally-added halogens [halogen-free flux]