The rollout of wireless communication networks began back in 1979 when Nippon launched the first commercially automated mobile network, known today as the first...
Folks, Although a few have suggested that lead-free reliability is an oxymoron, currently most people that have studied the reliability of SAC3XX and SAC105 Pb-free solders would conclude something akin to what Denny Fritz wrote in response to one of my...
Mobile devices are facing higher demands than ever—better cameras, better displays, and better battery life—all compacted into increasingly smaller spaces. Indium Corporation delivers electronics packaging and assembly materials such as fine powders for fine-feature printing or jetting and microdispensing as well as innovative products for system-in-packaging assembly that can help you overcome miniaturization challenges.
Indium8.9HF is a proven solder paste that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Indium8.9HF provides a unique oxidation barrier technology that eliminates HIP defects and graping, making it perfectly suited for mobile phone assembly and other electronics assembly applications.
Exceeds all requirements for enhanced electrical reliability and SIR performance
Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
Maintains excellent printing and reflow performance after remaining at room temperature for one month
Demonstrates consistent printing performance for up to 12 months when refrigerated
Resists premature flux spread to prevent surfaces from oxidizing
Indium12.8HF is an air and nitrogen reflow, no-clean, Pb-free solder paste specifically formulated to meet the demanding printing requirements of miniaturization in the mobile market. Indium12.8HF specifically addresses customers’ needs for a high-performance solder paste with Type 5 powder. This solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.
Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT-1, in combination with the SnBi alloys, can be especially useful as a low-temperature, Pb-free solution.
Low-temperature drop shock solution (*Patent Pending)
Durafuse®LT is a novel solder paste mixed-alloy system for low-temperature reflow processes which require high drop shock reliability. Durafuse®LT is made-up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides strength and durability. Durafuse®LT is ideal for high-reliability applications, using step soldering or for thermally-sensitive components.
Indium Corporation's Indium12.8HF jetting and microdispense solder paste is a no-clean, halogen-free material specifically formulated to be compatible with a wide range of microdispense and jetting systems.
Inherently chemically-compatible with Indium8.9HF Solder Paste, Indium12.8HF is optimized for long-term jetting and dispensing. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
For more information about Indium12.8HF Pb-Free Water-Soluble Lid-Attach Solder Paste, please download our product data sheet.
Indium Corporation's NC-SMQ 77 is a halogen-free, no-clean solder paste formulated to leave a completely benign, “invisible” residue. It is designed for reflow in a nitrogen or forming gas atmosphere of 100ppm oxygen or less. This product has superior wetting capabilities compared to most low-residue formulations and offers a no-residue appearance.
Indium Corporation’s SiPaste® 3.2HF is a water-soluble solder paste for system-in-package (SiP) designs. It is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s miniaturization in SiP design.
Consistent with our reputation for developing innovative new alloys, Indium Corporation continues to develop solutions to provide next generation low-temperature alloys. Our suite of low-temperature solder products ensures enhanced capability and reliability in cutting edge processes.
Low-temperature drop shock solution (*Patent Pending)
Durafuse®LT is a novel solder paste mixed-alloy system for low-temperature reflow processes which require high drop shock reliability. Durafuse®LT is made-up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides strength and durability. Durafuse®LT is ideal for high-reliability applications, using step soldering or for thermally-sensitive components.
One of the most popular lead-free bismuth solder alloys is Indalloy®282 (57Bi/42Sn/1Ag) which melts at 140°C. The addition of the 1% Ag makes the alloy more malleable. This alloy can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C), subsequent soldering operations can be done using a bismuth alloy. Indalloy®282 has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
Indium Corporation offers a full line of competitive, state-of-the-art fluxes for electronics assembly. Our materials enable the manufacture of strong, reliable products that endure the inevitable physical shocks and thermal stresses associated with mobile devices.
Indium Corporation’s flux-cored wire is well-known for its:
Variety of options to meet different application’s needs
Void-free consistency
Even-layer precision winding
And non-offensive odor for the 800 series and 200 series fluxes
CW-807 is Indium Corporation’s best-selling flux-cored wire, primarily because it is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and all common soft solder alloys. CW-807 yields superior results in automated operations, including laser soldering.
Indium Corporation’s Core 230-RC is a formula developed to meet the demanding requirements of robotic and laser soldering. It incorporates a highly effective activator package with new “no-spatter” technology in a high-reliability flux media.
Indium Corporation offers a full line of competitive, state-of-the-art fluxes for electronics assembly. Our materials enable the manufacture of strong, reliable products that endure the inevitable physical shocks and thermal stresses associated with mobile devices.
WS-446HF Flux is a robust, halogen-free, water-wash flux that was designed to provide one simple solution to complicated applications, especially those with a single cleaning step for flip-chip dipping and BGA ball-attach pin transfer/printing processes. It promotes excellent solderability and wetting on a wide range of surfaces, including the most demanding substrate metallizations. WS-446HF Flux eliminates ECM or dendrite formation caused by residue. It also minimizes die skew, non-wet opens, and missing balls, and promotes strong, low-voiding joints.
WF-7745 is a water-based, VOC-free, halogen-free, no-clean wave solder flux designed for wave soldering through-hole, bottom-side surface mount and mixed technology circuit boards. It performs well with both Pb-free and SnPb solders and processes. WF-7745 is non-flammable, dramatically reducing volatile organic compound emissions and eliminating special flammable storage conditions.
WF-9945 s a halogen-free no-clean flux developed for wave soldering mixed-technology and through-hole electronics assemblies. The rosin increases heat stability and widens the effective heat profiles, allowing for very high yield when wave soldering larger, thicker, and more complex circuit boards. WF-9945 is designed for use with tin-copper, tin-silver-copper, and tin-lead alloys.
Solder Fortification® Preforms are rectangular-shaped pieces of alloyed metal that do not contain any flux. The preform is added to a deposit of solder paste using standard pick and place equipment. Since the alloy for both the preform and the solder paste are the same, the preform will reflow at the same temperature as the solder paste, with the solder paste providing the necessary flux. The preform increases the volume of solder above what could be achieved with just solder paste, especially for applications using stencils with a pitch of 0.3mm or less.
The indium compound that is widely recognized today is indium tin oxide (ITO), a transparent conductor that is essential for building flat panel displays and touch sensors. TVs, computer monitors, tablets, and smart phones all use ITO to enable the switching of pixels and to register touch events. In fact, ITO applications dominate the use of all indium across the world today.
However, other indium compounds such as indium acetate and indium oxide also play important roles across various high-tech industries.
Indium acetate is a precursor to InP quantum dots. It is a white powder that is freely soluble in mineral acids and consists of needle-shaped crystals, which decompose to indium oxide upon heating.
IndiOx® (indium oxide or indium sesquioxide) is a yellow-colored powder. It is a stable ceramic-like material that is insoluble in water. IndiOx® is an n-type semiconductor and thus can be used as a resistive element in integrated circuits. It also is used to form heterojunctions with materials like p-InP, n-GaAs, n-Si, and other semiconductors.
IndiOx® Type T (indium oxide or indium sesquioxide) is a yellow-colored powder. It is a stable ceramic-like material that is insoluble in water. IndiOx® Type T is an n-type semiconductor. The particle morphology of Type T (target-grade) indium oxide is optimized for powder compaction to product high-density ITO and IGZO sputter targets. High-density targets result in superior sputter deposited layers on glass and plastic substrates. The higher specific surface area, coupled with a smaller primary particle size, provides sputter target manufacturers with a valuable variation when optimizing the ideal composition of the sputter target, and ultimately the device performance in the display electrodes or TFT transistors.
Indium tin oxide (ITO, or tin-doped indium oxide) is a mixture of indium(III) oxide (In2O3) and tin(IV) oxide (SnO2), typically 90% In2O3, 10% SnO2 by weight. In powder form, indium tin oxide (ITO) is yellow-green in color, but it is transparent and colorless when deposited as a thin film at thicknesses of 1000-3000 angstroms. When deposited as a thin film on glass or clear plastic it functions as a transparent electrical conductor.
Of the various transparent conductive oxides (TCOs), ITO is considered the premium TCO, having superior conductivity and transparency, stability, and ease of patterning to form transparent circuitry. ITO is used in a number of display technologies, such as LCD, OLED, plasma, electroluminescent, and electrochromatic displays, as well as in a number of touch screen technologies.
Gallium is a crucial material for building compound semiconductor devices. Gallium oxide is needed for sputtering targets that consist of indium, gallium, and zinc oxides. The IGZO or GIZO sputtering targets are used in next generation displays, where high currents and pixel densities make it necessary to use ever higher performing materials. The GIZO material offers the right properties to deposit high mobility active channels for the thin film transistors in the display’s active matrix backplane.
EZ-Pour® gallium trichloride is a granulated, free-flowing form of GaCl3.It is exceptionally easy to handle and can be poured easily from the container. No melting or use of solvents is required. Among other uses, gallium trichloride is used in GaAs RF chips.
Gallium oxide is the common term for gallium sesquioxide, or (Ga2O3). Gallium sesquioxide is used in phosphors, cathodes for solid oxide fuel cells, piezo-electric crystals, GGG crystals (gallium gadolinium garnets), and, most recently, in sputtering targets for GIZO or IGZO materials. These sputtering targets consist of gallium, indium, zinc, and oxide. GIZO or IGZO is the most attractive material for the flat panel component industry regarding emerging OLED displays, as it provides superior mobility for the thin film transistors that control the display pixels.
