Our many products are applied to numerous applications. For example, our:
solders are used for mechanical joining, electronics manufacturing, semiconductor device assembly, and more.
alloying expertise finds use in applications ranging from thermal management to thin-film technology to fusible devices.
inorganic compounds are critical ingredients in dry cell batteries, are precursors in the LED MOCVD process, and are used to optimize fiber optic devices, to name a few.
Explore these common applications of our many products, then contact us to tell us how we can work for you.
Automotive Electronic Assembly
Indium Corporation’s suite of proven, high-reliability materials, from solder paste to solder preforms, thermal interface materials, innovative solder alloys, metals, and compounds offers enhanced performance in automotive electronics assembly and packaging applications.
Indium Corporation is the leading joining and bonding materials innovator for semiconductor packaging and assembly and PCB assembly applications. With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C.
Indium Corporation is introducing the patent pending 3D EZ Release™ system for print plates used in powder bed fusion (PBF) printers. This system makes the removal of parts after 3D metal printing fast and simple.
PBF printers are capable of creating the most advanced metal parts, in a wide variety of build materials. However, in the standard PBF process, the printed parts are fused to the build plate and need to be mechanically separated using an electrical discharge machine (EDM), wire saw, or some other form of cutting tool. This can be time consuming and costly.
A variety of industries including automotive, transportation, computing, and energy infrastructure, are demanding more and more from power electronics systems. As this trend continues, it is critical that we continue to research, develop, and apply materials that address thermal, voiding, and all-around reliability challenges. Indium Corporation is the leader in power electronics assembly materials and leverages a broad portfolio of proven high-reliability solders, alloys, and thermal interface products to enable emerging power electronics solutions.
Indium Corporation offers materials for hermetic and cryogenic sealing, as well as for pass-throughs. These mission critical applications require unwavering assurances and reliability.
Gold (Au) is often used in electronics assembly because it does not oxidize or tarnish to any appreciable extent. This makes gold ideal for plating contact surfaces for switches and connectors.
Indium Corporation offers thermal evaporation materials for thin-film deposition. The purity of source material is as important as the equipment used for deposition. We offer the high quality materials and experienced technical support to help you get the most from your physical vapor deposition (PVD) process.
Indium Corporation is the leader in metal thermal interface materials (TIMs).
All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials.
