Applications
Indium Corporation’s extensive product range is utilized across a wide variety of industries and applications. Our cutting-edge solutions, known for high performance and reliability, are ideal for automotive electronic assembly, high-temperature soldering, power electronics packaging and assembly, and thermal management, among other areas.
Explore Common Applications for Our Products
See how our innovative materials are used across a wide range of variety of industries.
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2.5D & 3D Packaging
Techniques to incorporate multiple dies in a single
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Ball-Attach
Including both water-wash and no-clean ball-attach
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Bump Fusion
Achieve robust solder bumps on wafers with our wafer-bumping
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Burn-in & Test
Burn-in test solutions with soft metal alloys for improved
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Catalysis
Indium and gallium compounds for catalysis, chemical synthesis, and
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Cathodic Protection
Indium metal for sacrificial anodes and corrosion
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Chemical Synthesis
Indium and gallium compounds for chemical synthesis and materials
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Clip-Attach / Lead-Frame
Applications Clip and Lead Frame Attach In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and
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Connector & Cable Assembly
Solder tubes and washers for precision in connector and cable
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Die-Attach
Die-attach solutions include solder pastes to gold-based
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Electroplating
Try indium electroplating to enhance appearance and
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Flip-Chip
A crucial technique in advanced semiconductor
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Fluxless Solutions
Flux-free solder pastes and materials for formic acid
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High-Reliability
Various options for various high-reliability PCBA
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High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
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Hot Bar Soldering
Solder pastes, flux, and more for reliable hot bar
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Immersion Cooling
A technique on the rise for thermal
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Low-Temperature Liquid & Fusible Alloys
Low temperature liquid & fusible alloys for thermal and semiconductor
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Low-Temperature Soldering
Transform your operations with our low-temp soldering
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MEMs Assembly
Micro-Electro-Mechanical Systems
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Package-Attach
Wide selections to address the challenges in
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Package-on-Package
Crafted with optimal viscosity, flux technology, and
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PCB Assembly
Proven and cutting-edge materials for PCB assembly
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Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
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Rework
Our rework solutions include solder wire, TACflux, and
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Robotic Soldering
Quality flux-cored wire enhances robotic soldering
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Sealing: Cryogenic & Hermetic
Low temperature liquid & fusible alloys for precise melt
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Selective Soldering
A rising cost-effective and reliable method for
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Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
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SiP & Heterogeneous Integration Assembly (HIA)
System-in-package (SiP) and heterogeneous integration solutions
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Substrate/Spacer-Attach
Premier substrate-attach solutions in the power module
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Thermal Evaporation & PVD Coating
Achieve efficient and high-quality thin film
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Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
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TIM1, TIM1.5, TIM2
Metal-based TIMs deliver high thermal performance and
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Wave Soldering
Wave soldering is a pivotal soldering technique in
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is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.