Low-Temperature Soldering

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

Folks, Professor Patty Coleman is at it again. Let's listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job with

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

“A key ingredient that is critical to the solder paste formulation is rosin, which plays a significant role in enhancing the performance of the solder paste and hence providing high process

Folks, Peter writes: Dear Dr. Ron, I amthrilled with your Excel® program to calculate IMC thickness as a function of time. However, I wanted to calculate IMC thickness for times not listed in the

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

SMTA PanPac is a unique experience. In addition to the obvious draw of Hawaii in January, the conference tends to host thought leaders in the electronics industry. Along with the expected technical