PCB Assembly

PCB Electronics Assembly

Electronics assembly is one of the fastest changing, most demanding markets on the planet. As the electronics industry evolves to increasingly smaller, sophisticated, and more powerful devices, Indium Corporation continues to provide leading-edge materials and technology to solve today’s and tomorrow’s assembly challenges.
Whether you are qualifying a new product, looking for ways to improve process yields, or upgrading for future capabilities, Indium Corporation has the expertise and products to help you with your PCB Assembly needs
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Surface Mount Technology (SMT)
Low-Temperature Soldering

Low-Temperature Soldering

Indium Corporation makes a wide range of alloys that melt or reflow below 180°C and can be used to solve a great many assembly and other challenges.

Low-temperature solder is often used in electronics assembly including for these applications:

  • Attachment of temperature sensitive components to printed circuit boards
  • Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
  • Eliminating warpage of thinner chips due to high temperature reflow
  • Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
  • Large area array devices, such as BGAs, to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures