Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a no-clean PoP flux or PoP solder paste and placed on top of the logic chip. The whole assembly is then reflowed. Indium Corporation’s PoP materials are specifically-designed with ideal viscosity and rheology to allow for maximum flux or paste dipping transfer to the component bumps while maintaining consistency of volume.