Indium Corporation® featured our Precision Au-Based Die-Attach Preforms at SPIE Photonics West 2024, the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics...
Read MoreIn recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach...
Read MorePlating dies and/or substrates with pure gold works well to prevent the components from oxidizing, but can lead to undesirable gold-rich solder joints. Using an off-eutectic AuSn alloy as the solder material accommodates for these thick gold metallizations, allowing for the exact adjustment of the final solder joint composition to guarantee strong solder joints in die-attach applications.
Read MoreJust last month at the IMAPS show in Boston, Sze Pei Lim and I had the opportunity to chat with Francoise von Trapp from 3D InCites to discuss materials ai...
Read MoreThe International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities.
Read MoreApplications in Power Electronics
Indium Corporation offers and continues to develop new lead-free solders and materials that enhance reliability as conventional solder materials are reaching their performance limitations.
Solder preforms are used in a variety of applications that require precise amounts of solder. With hundreds of alloys to choose from and a refined manufacturing process focused on low-voiding power electronics applications, Indium Corporation provides design engineers with optimal solder preforms to maintain reliability in next generation power electronics applications. We offer solder preforms in standard shapes such as squares, rectangles, washers, and discs. Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.
High-quality solder ribbon manufactured by Indium Corporation is available in many standard alloys and sizes. Ribbon can also be custom-made to your unique material and dimensional requirements. Solder ribbon is supplied in continuous lengths and is packaged on spools. Whether you are looking for large quantities of solder ribbon in specific widths and thicknesses for automatic die bonding, or a few feet to do testing, Indium Corporation can accommodate your needs.
InFORMS® are reinforced solder preforms that help maintain a uniform bondline thickness. This maximizes the thermal and mechanical reliability of the solder joint, along with improving its strength. InFORMS® can be manufactured in a wide variety of shapes, including rectangles and discs, as well as custom shapes to suit specific application requirements. InFORMS® also come in the form of ribbon for integration with high-volume automated power module assembly systems.
A Heat-Spring® is a compressible interface between a heat source and a heat-sink and prevents the power die from overheating. The patterned surface of the Heat-Spring® optimizes performance. Unique Heat-Spring® properties include no pump-out or bake-out, as with thermal greases; better contact between surfaces to eliminate air voids; no required surface preparation; and easy cleanup. Heat-Spring® is available in standard and custom shapes and thicknesses.
m2TIM™ is a unique solid/liquid hybrid approach that combines liquid metal with a solid metal preform to provide very reliable thermal conductivity while eliminating the need for a solderable surface. This hybrid approach provides excellent surface wetting and low interfacial resistance, as well as eliminating the risk of pump-out of the liquid alloy.
Several very low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature; these alloys have reduced toxicity and lower vapor pressure than mercury. Alloy systems that are liquid at room temperature have a high degree of thermal conductivity and excellent electrical conductivity. These alloys also have extraordinary wetting ability to both metallic and non-metallic surfaces.
Indium Corporation’s Solder TIMs radically improve heat dissipation efficiency in electronic devices and thermal conductivity in high power devices. Applications include semiconductor integrated circuits, power QFNs, power device to PCB attach, telecom, die-attach, LED attach, and more. We provide custom solutions for your thermal interface problems, and find the right alloy for performance and best solder form for ease of assembly.
Indium Corporation’s QuickSinter® silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Indium Corporation provides high-performance precision gold preforms. Our manufacturing engineers have developed advanced gold and braze preform manufacturing technology to produce “best in class” precision preforms. These high-quality preforms redefine the boundaries of what’s capable in regard to complex designs and aggressive aspect ratios. Eutectic and off-eutectic options are available in preforms and ribbon.
Indium3.2HF Solder Paste with Indalloy®121 is an industry-proven water-soluble solder paste used for heat spreader attach.
