Applications
Substrate / Spacer-Attach
In power module assemblies, the substrate serves as the thermomechanical foundation, supporting active devices and interconnects. Traditionally, the substrate is attached to a baseplate. However, alternative methods, such as Dual-Side Cooling, use a spacer to provide both mechanical support and efficient heat dissipation. Both approaches face challenges such as thermal and mechanical stress, warpage, and CTE mismatch, making the choice of reliable substrate-attach materials critical.
Overview
Proven Materials Technologies to Achieve Design Goals
Indium Corporation’s solder performs feature a range of proven technologies, including InFORMS® reinforced preforms and the highly reliable Indalloy® 276. These materials are recognized as the premier substrate-attach solutions, widely utilized throughout the power module industry.
Benefits
Indium Corporation’s Substrate-Attach Materials Offer the following:
Semiconductor assembly involves the process of packaging and interconnecting semiconductor chips or integrated circuits, onto a substrate to create functional electronic devices.
Extended Device Life
Precision Design Control
Low Temperature Options
Seamless Integration
Ease of Use
Related Products
Our proven products help customers across industries increase yield and reduce time-to-market with reliable products.
Reinforced Preforms
InFORMS® reinforced solder preforms enhance joint reliability and
Solder Preforms
Solder preforms: versatile materials solving sealing & thermal
Indalloy®276
Pb-free solder offering high reliability up to
InTACK®
Power electronics assembly, tacking agent, no-clean, no-residue, formic acid reflow, solder preforms, dies,
Related Applications
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
High-Reliability
Various options for various high-reliability PCBA
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