- Dispense consistently
- Reduce blow holes and solder creep
- Suitable for all high-melting alloys (220-255ºC)
- No-intentionally-added halogens [halogen-free flux]
MEMS Assembly
Indium8.9HF Solder Paste
- Standard colorless residue
- Airless syringe packaging
- Complete wetting reduces blow holes
- Long dispense life
NC-SMQ®77 Solder Paste
- Ultra-low residue
- Does not contaminate MEMS surfaces with flux spatter
- Airless syringe packaging
- Proven in high volume manufacturing (HVM)
Indalloy® Chart
| Indalloy® Number |
Liquidus °C |
Solidus °C |
Elemental Composition (% by Mass) |
|---|---|---|---|
| 121 | 221 Eutectic | 96.5Sn/3.5Ag | |
| 267 | 224 | 221 | 97.0Sn/3.0Ag |
| 123 | 226 | 221 | 97.5Sn/2.5Ag |
| 243 | 227 Eutectic | 99.0Sn/1.0Cu | |
| 244 | 227 Eutectic | 99.3Sn/0.7Cu | |
| 262 (Sn995) | 227 Eutectic | 99.5Sn/0.5Cu | |
| 129 | 234 | 232 | 99.0Sn/1.0Sb |
| 131 | 237 | 235 | 97.0Sn/3.0Sb |
| 132 | 240 | 221 | 95.0Sn/5.0Ag |
| 133 | 240 | 237 | 95.0Sn/5.0Sb |
| 264 | 248 | 241 | 91.5Sn/8.5Sb |
| 259 | 257 | 243 | 90.0Sn/10.0Sb |
| 143 | 260 | 252 | 90.0Pb/10.0Sb |
| 10 | 267 | 235 | 75.0Pb/25.0In |
| 150 | 275 | 260 | 81.0Pb/19.0In |
| 182 | 280 Eutectic | 80.0Au/20.0Sn | |