![Avoid the Void®](/assets/landing-pages/avoidthevoid/images/atv-banner-112018.jpg)
Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.
Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.
![QFN Spectrum](/assets/landing-pages/avoidthevoid/images/qfn-spectrum.png)
![](/assets/landing-pages/avoidthevoid/images/atv-stability-r2.png)
Indium8.9HF Solder Paste
Indium8.9HF Solder Paste provides consistent performance after room temperature or cold storage, and throughout the assembly process.
Storage Conditions (unopened containers) |
Shelf Life |
---|---|
<10°C | 12 months |
<25°C | 30 days max |
Room Temperature Stable
![Room Temperature Stable](/assets/landing-pages/avoidthevoid/images/room-temperature-stable.png)
![](/assets/landing-pages/avoidthevoid/images/atv-minimizes-solder-beading-r2.png)
Indium10.1HF Solder Paste
Indium10.1HF Solder Paste minimizes solder beading and offers outstanding performance compared to the competitive material.
The solder beading test is designed to be a worst-case scenario and uses pad designs that aggravate solder beading.
Solder Beading Test | ||
---|---|---|
Paste | 0402 | 0603 |
Competitive Material |
65 | 16 |
Indium10.1HF | 7 | 6 |
![Solder Bonding](/assets/landing-pages/avoidthevoid/images/solder-bonding.png)
![](/assets/landing-pages/avoidthevoid/images/atv-in-circuit-testing-r2.png)
Indium8.9HF-1 Solder Paste
Indium8.9HF-1 Solder Paste provides industry-leading ICT probing first-pass yields due to the ease of probe penetration through the soft residue.
The following data represents an evaluation of Indium8.9HF-1 vs. four competitive materials in a production environment. Indium8.9HF-1 produced the best ICT First Pass Yield and exceptional printing First Pass Yield.
Solder Paste | SMT | ICT | ||
---|---|---|---|---|
Passed/ Total |
FPY | Passed/Total | FPY | |
G | 20/20 | 100% | 6/20 | 30% |
C | 20/20 | 100% | 13/20 | 65% |
B | 20/20 | 100% | 19/20 | 95% |
D | 20/20 | 100% | 19/20 | 95% |
Indium8.9HF-1 | 20/20 | 100% | 20/20 | 100% |
![](/assets/landing-pages/avoidthevoid/images/atv-hip-minization-r2.png)
Indium10.1 Solder Paste
Indium10.1 Solder Paste virtually eliminates the head-in-pillow defect (HiP) with industry-leading oxidation barrier flux technology.
![Failed Solder Joint](/assets/landing-pages/avoidthevoid/images/failed-solder-joint.png)
Whitepapers
Blog
Starvation Voids: When too little (paste) becomes too much (voiding)
Author: Indium Corporation®
Solder Fortification Preforms Revisited
Author: Adam Murling
Avoid The Void™ - Identifying Causes of Die-Attach Soldering Voids
Author: Dean Payne
Experts
![Placeholder photo for Christopher Nash](/assets/images/corporate/person-placeholder.png)
Christopher Nash
![Photo of Dr. Ning-Cheng Lee](/assets/images/corporate/dr-lee.png)
Dr. Ning-Cheng Lee
![Dr. Yan Liu](/assets/images/employees/Dr-Yan-Liu_600x600.jpg)
Dr. Yan Liu
![Dr. Ron Lasky](/assets/images/employees/Dr-Ron-Lasky_600x600.jpg)
Dr. Ron Lasky
![Photo of Tim Jensen](/assets/images/corporate/tim-jensen.png)
Tim Jensen
![Wisdom Qu](/assets/images/employees/Wisdom-Qu_365x365.jpg)
Wisdom Qu
![Karthik Vijay](/assets/images/employees/Karthik-Vijay_600x600.jpg)
Karthik Vijay
![Graham Wilson](/assets/images/employees/Graham-Wilson_600x600.jpg)
Graham Wilson
![Photo of Andy C. Mackie](/assets/images/employees/Andy-Mackie_600x600.jpg)
Andy C. Mackie, PhD, MSc
![Sze Pei Lim](/assets/images/employees/Sze-Pei-Lim_600x600.jpg)
Sze Pei Lim
![Kenneth Thum](/assets/images/employees/Kenneth-Thum_600x600.jpg)