Happy Birthday RoHS!
Folks, It was five years ago today that RoHS was launched, amid concerns that the world of electronics would collapse due to the......
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A New Low-Temperature Metallization Paste For Interconnecting Thin-Film Solar Cells
Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newe...
Tin-Silver (SnAg) Solder Alloy for Stringing and Bussing Solar Modules
Typical Tabbing Ribbon Solders img width="400" align="right" height="301" src="https://cdn2.content.compendium...
Tin/Silver Solder Paste in Die Attach (Sn/Ag)
A customer at Semicon West this year asked about Pb-free solder usage in die-attach applications. Although many smaller discrete components ...
Lead-Free Soldering Reliability: Dr. Ron Accused of Being, "Motivated Only by Greed"
Folks, Here is an interesting turn of events related to the reliability of lead-free (Pb-free) soldering reliability....
SAC Solder Alloy Wets Well, It Just Doesn't Spread Well
Folks, I have often pointed out that SAC solder’s poor wetting is both a curse and Godsend. It is a curse when trying to fill ...
Indium Corporation at Semicon West 2011
Many, many thanks to the hundreds of you who came by the Indium Corporation booth at Semicon West this year. Some of you came to hear about ...
Peter Borgesen Weighs in on Lead-Free Solder Reliability
Folks, I met Peter Borgesen back in the mid 1980s when he was a research scientist at Cornell working with Professor Che-Yu......
Moving Magnetics and Sputtering Target Material Utilization: An Interview with Frank Zimone
I recently had a discussion with Frank Zimone (VP of Business Development at Angstrom Sciences) about sputtering target utilization. He stressed the p...
Field Data Encouraging for Lead-Free Solder Reliability
Folks, Although a few have suggested that lead-free reliability is an oxymoron, currently most people that have studied the reliability of SAC3...
Thermocompression Bonding for Microbump Flip-Chip Soldering
For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D jo...