Posted On: January 30th, 2011 | By: Dr. Andy Mackie

Electromigration (EM) and Electrochemical Migration (ECM)

I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring as...

Posted On: January 28th, 2011 | By: Christopher Nash

Compatibility of Conformal Coatings versus No-Clean Solder Paste Flux Residues: When To Clean?

Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companie...

Posted On: January 26th, 2011 | By: Anny Zhang

红外探测器的散热---Use TIM for IR Detector

最近有一个客户，在咨询我们公司的散热੔...

Posted On: January 21st, 2011 | By: Dr. Andy Mackie

Package-on-Package (PoP) Solder Paste

A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...

Posted On: January 21st, 2011 | By: Dr. Ron Lasky

Is Technology Always Advancing?

Folks, Technology: Always Advancing? I believe most of us think of technology as always advancing. A quick look at the evolution of mobile p...

Posted On: January 19th, 2011 | By: Rick Short

Managing Interviews in Business to Business Marketing Communications

It is always important, sometimes critical, to come off well when interviewed. Most often the interviewer is an industry (or larger) celebrity and the...

Posted On: January 17th, 2011 | By:

Wave Solder Flux Deactivation Temperatures Explained

The “wave soldering flux deactivation temperature question” arises every few weeks, and the easy answer is that wave solder fluxes are des...

Posted On: January 14th, 2011 | By: Rick Short

No NUSE is Good News

I'd like to coin a term, "nuse". It means to use the news, in a bad way, to your benefit. This term came to mind as I observed variou...

Posted On: January 14th, 2011 | By: Dr. Andy Mackie

Epoxy Flux Dipping for CSP and PoP Applications

This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dippi...