Advanced Packaging Week (Day 2)
Today we will be discussing the first feature article appearing in the last issue of Advanced Packaging Magazine, “Weathering......
Today we will be discussing the first feature article appearing in the last issue of Advanced Packaging Magazine, “Weathering......
When I started writing technical articles for Indium Corporation, I needed to figure out which magazines I wanted to be......
Folks, I just finished teaching a new class (for me) The Technology of Everyday Things at Dartmouth. This class fills a lab and technology...
Rick Short Running Through Exhibition Details in Airport. I am sitting in an airport (cancelled flight, backup flight delayed), o...
In addition to Au/Sn sputtering pucks, Indium Corporation can also manufacture full size Au/Sn sputtering targets. 80Au/20Sn is......
The Indium team at the Semi-Therm exhibit Last week was Semi-Therm and it was a great time. With the economy suffering, I wasn’t sure......
Figure 1: Solderspatter (soldersplash) on Gold/Nickel Figure 2: Phase Inversion during Reflow ......
Solder Die Attach Image Courtesy of memsonics.com The clock is ticking before the extension of Pb-free legislation for high Pb-containi...
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
Folks I was chatting recently with Indium Corporation’s Mike Fenner about Sn/Cu alloys for solder paste. Mike has many years of experience ...