Solderability Testing of Die-Attach Solder Paste
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve ......
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Advanced Solder Paste is Key to Improving QFN Reliability
Paste deposits printed for a QFN footprint In an article from Circuits Assembly......
Advanced Aerodynamics
From a different link in the thermal chain: I noticed an article dealing with fan design that you might be interested in (click here). It’s nice...
Semiconductor Packaging Industry Trends for 2009
A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light......
Surface Preparation for Flux-less Reflow – The Solution
I can’t promise that every gold-indium or copper-indium soldering process can work without a flux, but there are tricks to give you a better cha...
Virtual Reality? The Virtual-PCB Online Tradeshow
For my next trick, I will be participating in a chat session as part of the Virtual PCB Show on February 25th from 11:00AM to 11:45 AM.......
Elementary, My Dear Watson...
One continual question from customers (and it’s a reasonable one) is why there are so few choices available for solder alloys, when there a...
Examine the Oxygen Bomb Test Report Carefully!
Indium Corporation is a big proponant of using the EN14582 oxygen bomb test method for halogen determination. However, we have seen misleading r...
Miniaturization Creates Single Solder Grain Concern
Folks, The advent of 0201 and even 01005 passives and CSPs with 30 mil lead spacings necessitate very small solder deposits in the stencil printing pr...