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Another SMTA Process Certification Question
Folks, The following question is one that students in SMTA Processes certification struggle with. Jim Hall and I are always a little surpri...
IPC Halogen-Free Podcast
Check out the IPC website to hear me discuss halogen-free challenges. I review many of the things that I have discussed in previous blog entries. Clic...
Issues with using Indium for Wafer Bumping
Lets talk about some issues… The first thing that I am worried about is......
Halogen-Free vs. Halide-Free Redo
As I discuss the differences between “halogen-free” and “halide-free” with respect to solder pastes and fluxes for electronics...
Applying TacFlux® to a Solder Thermal Interface Material
The process of applying a solder thermal interface material typically includes applying flux to a solder preform and reflowing it in......
Facts, Not Fluff, in B2B Marcom
"It takes savvy marketing to break through to electronics engineers, a group that wants straightforward information and facts, not overblown mark...
Package-on-Package Solder Paste for a High Yield Process
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...