Paul Socha at Semicon West 2008
Paul in action Paul describes how he contributes to the Engineered Solders Blog while at the show. p class="MsoNormal"......
Paul in action Paul describes how he contributes to the Engineered Solders Blog while at the show. p class="MsoNormal"......
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way......
I don't get paid to be average in B2B Marcom. This is something I have been saying for quite a while - and I mean it. Face it, who wants to ...
Solder TIMs are the bonding and joining material used to connect small, powerful dies to their substrates. ......
This is where the magic happens, before the show. Semicon West 2008 was......
I recently attended and spoke at the IPC’s conference in Boston titles “It’s Not Easy Being Green.” There was tons of useful i...
Folks, Peg writes: If the RoHS sweep does not scare you as a company, just wait for the REACH sweeps and SVHC list. RoHS is......
Our good friends at Circuits Assembly Magazine staged a virtual trade show (called Virtual PCB) several months back. Acc...
Dr. Harald Wack of Zestron img src="http://www.indium.com/_images/0725/zestron_cleaning_ball_attach_flux_wafer_2.jpg" alt="Weve lea...