"I don't get paid to be average!"
I don't get paid to be average in B2B Marcom. This is something I have been saying for quite a while - and I mean it. Face it, who wants to ...
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Die Size Vs. Temperature Cycles to Failure
Solder TIMs are the bonding and joining material used to connect small, powerful dies to their substrates. ......
Jim Hisert at Semicon West 2008
This is where the magic happens, before the show. Semicon West 2008 was......
What are the Big Guys Doing for Halogen-Free?
I recently attended and spoke at the IPC’s conference in Boston titles “It’s Not Easy Being Green.” There was tons of useful i...
Is REACH Going to Be RoHS Cubed?
Folks, Peg writes: If the RoHS sweep does not scare you as a company, just wait for the REACH sweeps and SVHC list. RoHS is......
Virtual Trade Shows in the B2B Environment
Our good friends at Circuits Assembly Magazine staged a virtual trade show (called Virtual PCB) several months back. Acc...
Zestron
Dr. Harald Wack of Zestron img src="http://www.indium.com/_images/0725/zestron_cleaning_ball_attach_flux_wafer_2.jpg" alt="Weve lea...
Choosing Powder Size Part 2: Printing
Solder paste for printing follows the same guidelines as solder paste for dispensing. The good news about solder paste for printing is the apertu...