Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Indium Corporation’s Dr. Ronald Lasky is a highly-educated, very experienced electronics assembly process & materials expert. We are lucky t...
Folks, Circuitnet recently had a posting stating that RoHS has cost industry, and hence we the consumer $32 billion. I’d say that’s about ...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
With only 24 hours to answer a customer regarding a strange flux / alloy / surface finish / temperature compatibility, we had no time to have an exoti...
Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics&l...
Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such a...
As many other companies are “going green” so can you with the right thermal interface material. Are you using indium materials now and col...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can l...