Intermetallic Growth
Time is precious, and some alloys take their precious time to form intermetallics. For lower melting point alloys, quick wetting doesn’t mean an...
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Thermal Interface Materials for Other Extreme Conditions
The typical extreme device needs an advanced thermal interface material to keep the interface cool while the device generates extreme amounts of heat....
The Infamous Cell Phone
Unquestionably one of the largest technology drivers in the last decade, the cell phone continues to challenge our industry by never being quite good ...
Engineered Solders with a European Flavour
Alan Fairbairn Guest Blogger European Business Development Manager Engineered Solders Materials I hope I can bring a European flavour to Engine...
How Low Can You Go?
Due to the limitations of flux, there is bottom end temperature where traditional solder/flux bonding ends. The lowest temperature I have experienced ...
Indium Corporation: founded in Utica, NY - "The City That Loves Refugees"
Today the Indium Corporation enjoys a rich global texture. With facilities and teammates in Milton Keynes, UK; Jurong, Singapore; Suzhou, Shenzhen, &a...
Thermal Interface Materials for Extreme Conditions
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Why Solder To Steel When You Can Solder To Copper?
Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. ......
Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
B2B Marcom Expertise
Indium Corporation’s Dr. Ronald Lasky is a highly-educated, very experienced electronics assembly process & materials expert. We are lucky t...