Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was t...
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Georgia Tech, SRC Research in Solderless Connections May Be Crucial to Future High Performance ICs
David writes, Dear Dr. Ron, I thought you would find the article below of interest. Is appears that now there is more than just Occam to worry about. ...
Beware Condensation on Substrate Bumping Paste
Anytime something cold is introduced into a warm/humid environment it will collect droplets of water from the surrounding air. Since substrate bumping...
After the Device Packaging Conference
Now the question that remains is, was the conference worth it? I believe it was. Customers concerns and possible solutions were realized. Industry con...
Is A Brand Ever Really "Owned"?
This was inspired by a great posting by Francois Gossieaux of Emergence Marketing I liked his posting so much I was moved ...
Day 3 of the Device Packaging Conference
The third day of the Device Packaging Conference has passed, with some interesting presentations from NXP, Amcor, and Atotech – to name a few. M...
Green Issues Continue in Popular Media, Halogen Free Interest Grows
Folks, In my blog posting of December 1, 2005, I asked PC Magazine’s “Cranky Geek” John Dvorak about his knowledge of RoHS. H...
Reverse E-mails
Ever sent out a half-baked e-mail? You know, one you haven't even finished proofing yet? We all have, and it is because we are in such a hurry tha...