Die-attach Stresses
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
Spheres are a great solder form for prototype work. (Pictured here are a range of sphere sizes, BGA size compared to flip chip size.) Solder spheres...
Can’t get enough of us? Members of Indium’s thermal management team will be attending MEPTEC’s 4th Annual Thermal Management symposi...
If you need me to troubleshoot your ball attach process, PoP process, flip-chip assembly process, or die-attach process, I’d be happy to come an...
Just in case you haven’t heard of epoxy flux yet, let me fill you in. Epoxy flux is what I call a “super no-clean” flux. A no-c...
For the second half of Solder Paste Transfer Efficiency, I would like to talk about tolerances and the Rule of 10% Standard Deviation (σ). From ...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
Folks, The team at Circuitnet has performed a poll on lead-free line usage. They asked the question: As we enter 2008, what percentage of your product...