Package-on-Package Reflow (5/5)
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But......
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
Simply stated, YES. In effort to stay on top of industry technology I spend as much time as I can afford attempting to learn about the current thermal...
I just returned from a business trip and encountered a common problem, solder paste squeegee hang up. But like nearly all of the cases I’ve seen...