Blogging Is Good (part 4,326,861,699)
As if you need any more support for blogging in your B2B practice. "With Yahoo and Google consistently ranked the No. 1 and No. 2 most frequen...
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Variables in Testing
It’s easy to have a test matrix escalate into a black hole of time, effort, and money (gulp!). Here are a few tricks to become more efficient at...
Soldering Basics
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
Ancient Text
I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from wor...
Interest in Metal Alloy Density Calculator Still Strong
Folks, I continue to receive regular requests for the Excel spread I developed that calculates alloy densities. We have a new improved (looks more att...
What is Semiconductor Packaging?
I’d say my version of the term is ‘protecting a semiconductor while facilitating its connection to the outside world’. Here’s ...
Package-on-Package Reflow (5/5)
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Welcome to the Engineered Solders Blog
Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But......
Transfer Efficiency 1: Solder Paste Height versus Component Pitch
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...