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Welcome to the Engineered Solders Blog
Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But......
Transfer Efficiency 1: Solder Paste Height versus Component Pitch
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...
Package-on-Package Transport (4/5)
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Package-on-Package Placement (3/5)
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
A Method to Attach Indium Interfaces over Large Surface Areas
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
Do LEDs need pure metal thermal interface materials?
Simply stated, YES. In effort to stay on top of industry technology I spend as much time as I can afford attempting to learn about the current thermal...
Solder Paste Squeegee Hang-Up
I just returned from a business trip and encountered a common problem, solder paste squeegee hang up. But like nearly all of the cases I’ve seen...
Package-on-Package Paste Leveling (1/5)
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
More B2B Viral Elfing
I recently posted on a cool site that has gone wildly viral. "Wildly" = >110,000,000 interactions. Not too shabby. A friend just ...