Control Your Materials, or They Will Control You (part 2)
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on th...
Folks, Recently the concern for e-waste has hit the mainstream media. The most thorough article being in National Geographic with supporting articles ...
A material trial can be a roll of the dice, or a very scientific experiment. Most customers don’t realize how much we crave new data points and ...
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This...
We received a call today from a customer that had tested the halide content of their board and reflowed solder paste, without components, using Ion Ch...
Package-on-Package processing steps can create delays in getting to the reflow process. If you are new to stacking components, consider the mainstream...
We commonly think of flux itself as the reason it should only be used for 8 hours at a time. As the workable life of new fluxes increase,......
Many people do not consider either semiconductors or solar cells as having any moving parts. But this is not completely true. Indeed, every solar cell...
Think YOUR product isn't sexy??? Try differentiating a toilet seat. These people did According to a Marketing Profs newslette...