Durafuse® LT - New Mixed Low Temperature Solder Technology!
New Durafuse® LT is a novel mixed alloy system designed to combine low temperature solder reflow with drop-shock performance similar to or be...
New Durafuse® LT is a novel mixed alloy system designed to combine low temperature solder reflow with drop-shock performance similar to or be...
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....
Copper smelting was critically important to the development of civilization - and it was a miracle it ever began. Perhaps the beauty of this ore led i...
This coming February will be my third SMTA PanPac. PanPac is a very enjoyable and rewarding conference with a full venue. Costs are reasonable as well...
Folks, A short time ago, I posted on how to size a reflow oven. I mentioned that I had developed an Excel Spreadsheet to perform the calculations. The...
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....
We have all ordered something in the wrong size - it’s frustrating! Today we discuss specifying the dimensions for pure indium preforms....
A good solder paste should be able to remain in a paused position (i.e. not being printed) on the stencil, for more than an hour....