Minimizing the Head-in-Pillow Defect in SMT Assembly
This video is for those in the SMT electronics assembly industry that want to minimize the head-in-pillow defect. It discusses the solder paste proper...
This video is for those in the SMT electronics assembly industry that want to minimize the head-in-pillow defect. It discusses the solder paste proper...
This video is for electronics assembly engineers, technicians, and managers who are looking to match a reflow profile to solder paste specifications. ...
This video is for electronics assemblers who currently or are considering using nitrogen during their processes. It includes details regarding when ni...
This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not statistical sampling ...
This video is for electronics assembly professionals who are looking to improve their wave soldering processes. It includes tools and resources that w...
This video is for electronics assemblers that are seeking the correct wave soldering profile, as well as optimal line balancing. This includes real-wo...
We explore cleaning techniques for Internet of Things (IoT) devices. It will cover water-soluble and no-clean materials and process....
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
Electronics manufacturers who have considered implementing nitrogen in their soldering process know the largest obstacle is cost. Let's explore....
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...
Indium Corporation's Marketing Communications Specialist Colleen Bierstine discusses SMT Processes Certification with the creators of the SMT Proc...