Optimize the Zero Stress Point
An important quote from Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures is: “This suggests that a target bonded at one...
An important quote from Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures is: “This suggests that a target bonded at one...
If you’re looking to catch up on the latest developments in CPV here’s a free event in which you can take part from the comfort of your of...
Folks, Let’s see what is up with Patty…..... Patty sat at her computer, admittedly a little tired. She had just gotten back after a...
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...
Coefficient of Thermal Expansion (CTE) differences between materials can really cause problems when those materials are rigidly bonded. If you’v...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are ...
“The standard process was used as described: The pieces were assembled with a reactive multilayer foil between the aluminum and molybdenum, with...
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually ...
Why do we care so much about target bonding? This is important because a sputtering target that truly performs will allow greater process flexibility,...
Whenever two materials with different coefficient of thermal expansion values are bonded together, they will expand and contract as the temperature ch...