Variables in the Package-on-Package Process
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While...
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While...
We’ve heard about the solder paste “graping” defect, but the same oxidation challenge occurs in other solder forms as well, such as ...
Tin-coated NanoFoil® is not one, but two very different products, combined. It is a heat source and a form of solder. In the world of interconnect...
前段时间我们接触了“Strategic Selling” 和 “Conceptual Selling”į...
InCuSil™ is a common term for an alloy of indium, copper, and silver which (depending on composition) has various melting points in the brazing ...
Folks, Let’s see how Pete is handling the wave solder crisis. Pete had to admit that he was surprised by the positive outcome of his meeting wit...
There are a lot of parameters to consider when choosing the right solder for your application: 1) The operational temperature of the final device p st...
Today we celebrate the birthday of the co-discoverer of indium, Hieronymus Theodor Richter. Hieronymus Theodor Richter (pictured left) (2...
Over the years, solder alloy choices have been pretty stable. In the last century, SN63 and SN62 could be found at any company making any k...
We commonly receive questions like: “Can NanoFoil® be used to bond silicon?” or, “What surface flatness do I need to NanoBo...
NanoFoil® is described as “reactive multilayer foil”. It is comprised of many alternating layers of aluminum and nickel which are eac...