Posted On: February 9th, 2024 | By: Jason Farrell

SPIE Photonics West 2024

Indium Corporation® featured our Precision Au-Based Die-Attach Preforms at SPIE Photonics West 2024, the world’s premier event for...

Posted On: December 19th, 2022 | By: Jenny Gallery

Which Off-Eutectic AuSn Alloy Do I Use?

Plating dies and/or substrates with pure gold works well to prevent the components from oxidizing, but can lead to undesirable gold-rich solder joints...

Posted On: June 1st, 2022 | By: Jenny Gallery

IMS 2022!

The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...

Posted On: May 3rd, 2022 | By: Jenny Gallery

When Life Gives You Lumens, Make LED Paste!

AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and asse...

Posted On: October 27th, 2020 | By: Jenny Gallery

‘Aye, you,’ do you make jewelry?

While continuing to be a premier solder materials manufacturer and supplier, Indium Corporation now manufactures and supplies jewelry making materials...

Posted On: August 10th, 2020 | By: Jenny Gallery

What the Off-Eutectic?

Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic Au...

Posted On: June 1st, 2020 | By: Jenny Gallery

That's a 'Fine' Ribbon You Got There!

Indium Corporation has developed 80Au20Sn < 0.1” wide fine-grade precision ribbon for high volume, fully automated laser diode assembly proce...

Posted On: April 6th, 2020 | By: Jenny Gallery

Size Does Matter!

How solder powder size can effect solder paste performance....

Posted On: March 11th, 2020 | By: Jenny Gallery

Why Do We Need to Go Thinner?

Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...

Posted On: October 18th, 2019 | By: Bernard Leavitt

Why is AuSn powder size important for solder paste application?

Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...

Posted On: October 18th, 2019 | By: Bernard Leavitt

How does AuSn alloy and flux impact the reliability of solder paste?

When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...