Common Ball Grid Array Failures and How to Avoid Them
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...
BGA
Tech Seconds with Phil Zarrow: Best Place to Attach Thermocouples
Indium Corporation’s Tech Seconds video series answers electronics assembly industry’s most commonly asked question in 60 seconds or less....
One-Step Soldering in Flip-Chip Assembly
This video is for anyone interested in flip-chip/BGA balling using the one-step assembly process. Keywords: Phil Zarrow, Andy Mackie, amackie@indium.c...
Flux Challenges Regarding Flip-Chip/BGA Balling
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporati...
Flip-Chip/BGA Balling: Halogen-Free/Halide-Free
This video discusses the halogen-free issues of BGA/flip-chip balling. Keywords: Phil Zarrow, Andy Mackie, flip-chip, BGA, balling, halogen......
In Soldering, What is an NWO?
An NWO is a defect where the paste goes with the ball on a BGA and does not wet to the board pad....
SMTA International 2015, One Month Away!!!
SMTA International 2015 is just around the corner. If you want to see what our engineers will be presenting at the show check out this blog; there is ...
Lead Free 2015
Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...
Growing Interest in Bi-Containing Solder Alloys: Bismuth Rocks!
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders...
SMTA International 2014 in Retrospect
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
Stencil Printing for SMT Assembly Success Part 2: Print Metrics
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
One-Step OSP BGA Soldering Application
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...