Lead (Pb) in ELV Solder: European Automotive Electronics Legislation - Feb 2010 Update
Those of you have been watching this blog for a while will know that I’ve been keeping tabs on the status of the European ELV (End-of-life vehic...
Those of you have been watching this blog for a while will know that I’ve been keeping tabs on the status of the European ELV (End-of-life vehic...
The use of gold layers deposited onto nickel is standard in many industries, from DRAM memory module edge connectors, to electrical test probe co...
After you’ve reflowed solder in contact with a flux, you’re always left with a certain amount of flux residue. There are no clear industry...
It’s no secret that I love WS3622. The water soluble flux is a magic bullet for......
A few of Indium’s solder experts ready to assist. I am well aware that many of you are now working in stressed out, short-handed workplaces and ...
Photo courtesy Optocap Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer…br......
Have you ever had a hard time getting help with something? For the last year I’ve been searching......
Etched Indium Ribbon Wound Back on Itself and cold-welded to form a loop. Die assembly often involves......
Michael Qiu of Indium Corporation f eqn="sum 0 1 0"></f><f eqn="sum 0 0 1">f eqn="prod 2 1 2">&...
Low residue flux for flip chip attachment has many advantages (please see Ultra Low Res Flip Chip Flux) over standard no-clean and water soluble fluxe...