Tips for Successfully Using Vacuum Reflow Ovens in SMT Soldering
Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow. Here's how to achieve the&...
Christopher Nash's Blog
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design
Learn about the many factors associated with BTC voiding reduction. ...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Solder Paste
Solder paste properties have a large effect on voiding. I dig into this area deeply and talk about how we can minimize large ground plane solder...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design
We can minimize large ground plane solder voiding in electronics assembly by modifying stencil design. ...
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Surface Finish
Did you know that the right PWB surface finish can minimize large ground plane solder voiding in electronics assembly? I'll tell you how....
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment
Voiding beneath Large Ground Planes in Electronics Assembly can be minimized by optimizing the assembly environment. Learn how....
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Ishikawa Diagram
Electronics manufacturers can AVOID THE VOID® using statistical tools like the Ishikawa diagram. Map out your process. Create an excellent visual ...
PoP Flux Dipping Process Inspection: Colored Flux
Indium Corporation's new colored fluxes for PoP flux inspection and assembly....
Epoxy Flux Dispensing and/or Jetting
The dipping process is a convenient process to use for the application of Epoxy Flux because most pick and place equipment already have dipping units ...