Here is a pretty good list of resources on the topic of corrosion, if you’re interested:
1. Chongchen Xu. “Corrosion in Microelectronics“ 2003
2. Charles A. Harper. Electronic Packaging and Interconnection Handbook. Third
Edition. McGRAW-HILL, 2000.
3. Electronic materials handbook, vol.1, ASM international, 1989.
4. A.J. Griffin, S.E. Hernandez and F.R. Brotzen. “A galvanic series for thin-film
metallizations and barrier layers commonly used in the microelectronics
industry”, Journal of electrochemistry society, 141(3), 807-809 (1994).
5. Deny A. Jones. “Principles and prevention of corrosion”. Prentice Hall, Upper
Saddle River, second edition, 1996.
6. W.M. Paulson and R.P. Lorigan. “The effect of impurities on the corrosion of
aluminum metallization”, Proceedings of the IEEE Reliability Physics
Symposium, IEEE, 42-47 (1976).
7. Andrew H. Rawwicz. “Stress induced corrosion of wire micro-joints in
microelectronics – a quantitative model”, Microelectronics and Reliability, 34(5)
875-882 (1994).
8. M. Hansen and K. Anderko. Constitution of binary alloys. Mcgraw-Hill, 1958. 22
9. W.W.Binger, E.H. Hollingsworth and D.O. Sprowls. Aluminum, vol.1, American
Society of Metals, 1967.
10. Simon Thomas and Howard M. Berg. “Micro-corrosion of Al-Au bonding pads”,
IEEE transactions on components, hybrids and manufacturing technology, 10(2),
252-257(1987).
11. Joseph Fauty, Steve Strouse, Jay Yoder, Carlos Acuna, and Phil Evard. “Al-Cu
metal bond pad corrosion during wafer saw”, The International Journal of
Microcircuits and Electronic Packaging, 24(1), 19-29(2001).
12. Fu-gin Chen and A. Jean Osteraas. “Electrochemical dendrite formation during
corrosion of connector leads”, Proceedings of ASM’s third conference on
electronic packaging: materials and processes and corrosion in microelectronics,
175-179(1987).
13. Kim A. Berry. “Corrosion resistance of military microelectronics packages at the
lead-glass interface”, Proceedings of ASM’s third conference on electronic
packaging: materials and processes and corrosion in microelectronics, 55-61(1987).
14. M.J. Elkind and H.E. Hughes. “Prevention of Stress-Corrosion failure in ironnick-
cobalt alloy semiconductor device leads”, Proceedings of Failure in
Electronics Symposium, 5, 477-495 (1966).
15. K.W. Rosengarth. “Corrosion Protection for semiconductor packaging”, Solid
State Technology, 27, 1991-196 (1984).
16. Vlasta Brusic, Doreen D. Dimilia and Robert D. Maclnnes. “Corrosion of lead, tin
and their alloys”, Proceedings of ASM International 3rd electronic materials and
processing, 261-268(1990).
17. Michel Pecht. “A model for moisture induced corrosion failures in
microelectronic packages”, IEEE transactions on components, hybrids and
manufacturing technology, 13(2), 383-389(1990).